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آلة الليزر PCB Depaneling
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300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

الاسم التجاري: Winsmart
رقم النموذج: SMTL300
مو: 1 مجموعة
السعر: USD1-150K/set
تفاصيل التغليف: حالة الخشب الرقائقي
شروط الدفع: ل / c، / تي تي، ويسترن يونيون
معلومات تفصيلية
مكان المنشأ:
الصين
إصدار الشهادات:
CE
مادة ثنائي الفينيل متعدد الكلور:
FR4 الشركة العامة للفوسفات
مصدر الليزر:
25W UV
جدول العمل:
300x300mm ، الجداول المزدوجة
التثبيت:
حسب الطلب
الطول الموجي:
355 نانومتر
الاسم:
آلة إزالة لوحة PCB بالليزر UV
القدرة على العرض:
100 مجموعة في الشهر
وصف المنتج

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

 

 

UV Laser PCB Depaneling Machine Overview:

A UV Laser PCB Depaneling Machine is a high-precision system used to separate (depanel) individual printed circuit board units from a larger panel without mechanical stress or contamination. The 300mm × 300mm working area makes this machine suitable for medium-sized PCBs used in mobile devices, medical devices, automotive electronics, and more.
Unlike traditional depaneling methods (e.g., routing, punching, or V-cutting), this machine uses a UV laser to cleanly and accurately cut through PCB substrates (FR4, polyimide, etc.) with no mechanical contact, ensuring no stress, no dust, and no delamination.

 

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine 0

 

UV Laser PCB Depaneling Machine Features:

300×300mm Working Area: Supports medium-sized PCB panels with high flexibility.

UV Laser Cutting: Uses a 355 nm UV laser for high-precision, low-thermal-impact cutting.
No Mechanical Stress: No contact means no micro-cracks or component damage during depaneling.
Dust-Free Operation: No routing or sawing = zero dust and no need for post-cleaning.
High Precision & Accuracy: Cutting accuracy typically ±10 μm or better.
Vision System: CCD camera for fiducial recognition and dynamic alignment.
Programmable Cut Paths: Supports DXF/Gerber file import for complex board outlines.
Low Heat-Affected Zone (HAZ): UV laser minimizes thermal stress and carbonization.
Safety Enclosure: Fully enclosed design with laser shielding and interlock protection.
Auto Mark Alignment: Ensures perfect alignment for repeated, precision cuts.

 

UV Laser PCB Depaneling Machine Specifications:

Model SMTL300, dual tables
Power 380V AC, 50Hz, 20A
Compressed Air Compressed air
Machine Dimension 1450(L)x1350(W)x1665(H)mm
Installation Space 3000x3000x2500mm
Machine Weight 800kgs
Ambient Temperature 22 ~ 25 ℃
temperature variation within ± 1 ℃ / 24hr
ambient humidity within 40% ~ 70% (no obvious condensation is allowed)
Dust free grade 100000 or better
power consumption 6KW
Cutting width ≤ 50mm × 50mm
Cutting materials full cut / half cut of PCB / FPC, LCP / glue and other related materials
Cutting thickness ≤ 3mm
Cutting speed ≤ 3000mm / S
Overall machining accuracy ≤ 30um
Processing pattern straight line, slash, curve, abnormity, etc
Laser 355nm light wave nanosecond laser
Repetition frequency 50-150khz
Laser Power UV 15W@30KHz
Pulse width < 20ns
Energy stability < 3% RMS over 8hours
Beam quality m ² < 1.3
Mode 2500mm/S
Warranty 1 year
Service Oversea training is available

 

 

UV Laser PCB Depaneling Machine Advantages:

UV Laser PCB Depaneling Machine is a high-precision, non-contact depaneling solution designed for cutting, drilling, and marking printed circuit boards (PCBs). It is widely used in electronics, medical devices, automotive, aerospace, and telecommunications industries where high precision and minimal stress are required.

It is used in PCB depaneling due to its short wavelength (355nm) and high absorption efficiency in PCB materials like FR4, polyimide, ceramics, and aluminum-backed substrates. This ensures clean, precise cuts with minimal thermal impact.

 

UV Laser PCB Depaneling Machine Applications:

Smartphone and tablet PCBs
Wearable device electronics (smartwatches, fitness bands)
Medical and implantable devices
Automotive ADAS and infotainment boards
High-density rigid-flex PCBs
LED panel and lighting module depaneling

 

سعر جيد  الانترنت

تفاصيل المنتجات

المنزل > المنتجات >
آلة الليزر PCB Depaneling
>
300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

الاسم التجاري: Winsmart
رقم النموذج: SMTL300
مو: 1 مجموعة
السعر: USD1-150K/set
تفاصيل التغليف: حالة الخشب الرقائقي
شروط الدفع: ل / c، / تي تي، ويسترن يونيون
معلومات تفصيلية
مكان المنشأ:
الصين
اسم العلامة التجارية:
Winsmart
إصدار الشهادات:
CE
رقم الموديل:
SMTL300
مادة ثنائي الفينيل متعدد الكلور:
FR4 الشركة العامة للفوسفات
مصدر الليزر:
25W UV
جدول العمل:
300x300mm ، الجداول المزدوجة
التثبيت:
حسب الطلب
الطول الموجي:
355 نانومتر
الاسم:
آلة إزالة لوحة PCB بالليزر UV
الحد الأدنى لكمية:
1 مجموعة
الأسعار:
USD1-150K/set
تفاصيل التغليف:
حالة الخشب الرقائقي
وقت التسليم:
5-30 أيام
شروط الدفع:
ل / c، / تي تي، ويسترن يونيون
القدرة على العرض:
100 مجموعة في الشهر
وصف المنتج

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine

 

 

UV Laser PCB Depaneling Machine Overview:

A UV Laser PCB Depaneling Machine is a high-precision system used to separate (depanel) individual printed circuit board units from a larger panel without mechanical stress or contamination. The 300mm × 300mm working area makes this machine suitable for medium-sized PCBs used in mobile devices, medical devices, automotive electronics, and more.
Unlike traditional depaneling methods (e.g., routing, punching, or V-cutting), this machine uses a UV laser to cleanly and accurately cut through PCB substrates (FR4, polyimide, etc.) with no mechanical contact, ensuring no stress, no dust, and no delamination.

 

300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine 0

 

UV Laser PCB Depaneling Machine Features:

300×300mm Working Area: Supports medium-sized PCB panels with high flexibility.

UV Laser Cutting: Uses a 355 nm UV laser for high-precision, low-thermal-impact cutting.
No Mechanical Stress: No contact means no micro-cracks or component damage during depaneling.
Dust-Free Operation: No routing or sawing = zero dust and no need for post-cleaning.
High Precision & Accuracy: Cutting accuracy typically ±10 μm or better.
Vision System: CCD camera for fiducial recognition and dynamic alignment.
Programmable Cut Paths: Supports DXF/Gerber file import for complex board outlines.
Low Heat-Affected Zone (HAZ): UV laser minimizes thermal stress and carbonization.
Safety Enclosure: Fully enclosed design with laser shielding and interlock protection.
Auto Mark Alignment: Ensures perfect alignment for repeated, precision cuts.

 

UV Laser PCB Depaneling Machine Specifications:

Model SMTL300, dual tables
Power 380V AC, 50Hz, 20A
Compressed Air Compressed air
Machine Dimension 1450(L)x1350(W)x1665(H)mm
Installation Space 3000x3000x2500mm
Machine Weight 800kgs
Ambient Temperature 22 ~ 25 ℃
temperature variation within ± 1 ℃ / 24hr
ambient humidity within 40% ~ 70% (no obvious condensation is allowed)
Dust free grade 100000 or better
power consumption 6KW
Cutting width ≤ 50mm × 50mm
Cutting materials full cut / half cut of PCB / FPC, LCP / glue and other related materials
Cutting thickness ≤ 3mm
Cutting speed ≤ 3000mm / S
Overall machining accuracy ≤ 30um
Processing pattern straight line, slash, curve, abnormity, etc
Laser 355nm light wave nanosecond laser
Repetition frequency 50-150khz
Laser Power UV 15W@30KHz
Pulse width < 20ns
Energy stability < 3% RMS over 8hours
Beam quality m ² < 1.3
Mode 2500mm/S
Warranty 1 year
Service Oversea training is available

 

 

UV Laser PCB Depaneling Machine Advantages:

UV Laser PCB Depaneling Machine is a high-precision, non-contact depaneling solution designed for cutting, drilling, and marking printed circuit boards (PCBs). It is widely used in electronics, medical devices, automotive, aerospace, and telecommunications industries where high precision and minimal stress are required.

It is used in PCB depaneling due to its short wavelength (355nm) and high absorption efficiency in PCB materials like FR4, polyimide, ceramics, and aluminum-backed substrates. This ensures clean, precise cuts with minimal thermal impact.

 

UV Laser PCB Depaneling Machine Applications:

Smartphone and tablet PCBs
Wearable device electronics (smartwatches, fitness bands)
Medical and implantable devices
Automotive ADAS and infotainment boards
High-density rigid-flex PCBs
LED panel and lighting module depaneling